Solder |
Tin |
Copper |
Silver |
Lead |
Antim. |
Initial |
Recommended |
| SILVABRITE 100 | 95.5% |
4.0% |
0.5% |
-- |
-- |
227 ºC |
227 - 260 ºC |
| 50/50 Tin/Lead | 50.0% |
-- |
-- |
50.0% |
-- |
183 ºC |
183 - 216 ºC |
| 95/5 Tin/Antimony | 95.0% |
-- |
-- |
-- | 5.0% |
221 ºC |
221 - 245 ºC |
Total impurities are present in levels less
than 0.0015 (0.15%)
Density
|
Bulk Room Temperature Tensile Strength
|
Pressure Rupture Test:
Soldered joints using
SILVABRITE 100 and L type copper tube (up to 25 mm(1") diameter)
at room temperature, 121 ºC and 149 ºC, withstood pressure to the extent
that failure occurred in the copper tube and not the soldered joint.
Stress Rupture Test (Creep
Strength):
Standard 13 mm (1/2") copper
couplings are soldered in this test and put under constant loads. The
time which the joint failed by breaking is indicated in the table below:
| Solder | 771 kg |
680 kg |
544 kg |
318 kg |
227 kg |
| SILVABRITE 100 | 5 days |
7 - 8 days |
144 days |
--- |
--- |
| 50/50 Tin/Lead | < 1 day |
< 1 day |
< 1 day |
5 - 7 days |
33 days |
| 95/5 Tin/Antimony | N/A |
N/A |
N/A |
N/A |
N/A |
Corrosion Test Data:
Using standard Tefal electrochemical
techniques and ASTM - Corrosive Water D1384, the following corrosion test data
has been compiled
|
SILVABRITE 100 is twice as corrosion resistant as 50/50 Tin/Lead and seven times as corrosion resistant as 95/5 Tin/Antimony. With less corrosive water the differences between these solders will drastically increase. |